We find the problem before you order the boards
Fixing a layout error takes an engineer a few hours. Fixing it on finished prototypes means a new batch of boards, rework and a missed deadline. At gigahertz speeds, traces, vias and IC packages become part of the circuit and act as transmission lines. Intuition is no longer enough. We simulate the board at the design stage and show exactly what threatens the device’s operation and by how much.
Types of analysis
What we simulate
Signal integrity
Impedance, reflections, crosstalk, conductor and dielectric losses, jitter and skew. Eye diagrams and S-parameters for high-speed interfaces.
Power integrity
Voltage drop and current density across planes, power distribution network impedance, decoupling capacitor selection.
Electromagnetic compatibility
Emission and susceptibility assessment before certification testing, so that you do not have to redesign the board after a failed test.
Thermal analysis
Temperature maps of the board and enclosure, selection of heat sinks and thermal management.
Vibration resistance
Calculation of natural frequencies and stresses under vibration and shock for equipment operating in harsh conditions.
What you get
A report with conclusions and specific recommendations for changes to the layout, stack-up or schematic. We simulate both boards we design and projects done by your team.
We check the board before you order it
Send us your project: we will show what threatens the device’s operation and propose specific changes to the layout or stack-up.